A Semiconductor Packaging & Testing Company (Confidential)某半导体封装测试企业

To protect the client's privacy, this case withholds the name and identifying details; only industry and outcomes are shared.

This is an optoelectronic chip company that develops, manufactures and sells optoelectronic chips, with products used in optical communication, industrial lasers, sensing and consumer applications; its main lines cover a full range of laser and detector optical chips and packaged products.

The hard part of optical-chip manufacturing lies in subcontract processing, which involves many steps and a long chain: raw materials must flow through purchasing, subcontract material issue, leftover-material reconciliation, subcontract goods receipt and processing-fee settlement. With so many steps, costs are easily blurred and progress becomes unclear. Using SAP Business One on HANA, MTC linked subcontract quota management, leftover-material reconciliation, goods receipt and processing-fee settlement into one traceable chain, and configured resource management, capacity, scheduling and production execution, so that at month-end close, cost elements such as equipment, labor hours and materials all have data to draw on.